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EcoCvolta 价格: 编号:EcoCvolta 产地:德国

极高的敏感部件高速清洗解决方案

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EcoCvolta——专为对洁净度要求极高的敏感部件提供高速清洗解决方案

凡是大量生产对部件洁净度要求极高的敏感部件的场合,EcoCvolta 都是理想的清洗解决方案。得益于连续流原理,它可完美集成到所谓的“大批量生产线”中。该系统可轻松连接至洁净系统或洁净室系统,以防止组件发生不必要的回污染。凭借多种工艺模块的选择,EcoCvolta 能够满足广泛的清洗任务需求。

典型工艺及组件几何尺寸要求

  • 组件尺寸(zui大):1,000 x 270 x 150 毫米 – 其他尺寸可定制。

  • 材料厚度:0.050 至 20 毫米——其他厚度可按要求定制。

  • 材料:带涂层或无涂层材料;不锈钢或钛——其他材料可按要求定制。

  • 污染物:颗粒、冲压油、乳化液、毛刺、碎屑毛刺、未知薄膜污染物。

  • 循环时间:0.5 秒至 10 秒 / 单极或双极板。

  • 颗粒残留污垢要求:zui大颗粒尺寸100 μm至300 μm。

  • 薄膜洁净度要求:38至48 mN/m,无油及分子级油成分。

  • 表面不得含有某些未经授权的物质,例如磷、清洁剂、表面活性剂、硫、硅酮、硅、任何有机物。

双极板的可能清洗工艺

  • 高压喷淋清洗

  • 低压喷淋清洗

  • 蒸汽清洗

  • 水力清洗

  • 二氧化碳射流清洗

  • 激光清洗

  • 大气压低能等离子体

  • 高能等离子体工艺

  • 惰性气体氛围下的热油脱除

EcoCvolta – High-speed Cleaning for Sensitive Components with High Cleanliness Requirements

Wherever sensitive components are manufactured in large quantities with high demands on component cleanliness, the EcoCvolta can be the right solution for cleaning. Thanks to the continuous flow principle, it can be perfectly integrated into so-called „high-volume production lines“. The system can be easily connected to clean or cleanroom systems to prevent unwanted back-contamination of components. The EcoCvolta is able to cover a wide range of cleaning tasks thanks to the selection of different process modules.

Typical process and component geometry requirements

Component dimensions (max): 1,000 x 270 x 150 mm – other dimensions on request.

Material thickness: 0.050 to 20 mm - other material thicknesses on request.

Material: Material with and without coating; stainless steel or titanium Further materials on request.

Contamination: Particles, punching oils, emulsion, burrs, flitter burrs, unknown filmic contamination.

Cycle times: 0.5 seconds up to 10 seconds / monopolar bipolar plate.

Particulate residual dirt requirements: maximum particle size 100 μm up to a maximum of 300 μm.

Filmic cleanliness requirement: from 38 up to 48mN/m, free of oils and molecular oil components.

Free of certain unauthorized substances on the surface, such as phosphorus, cleaning agents, surfactants, sulfur, silicones, silicon, any organics.

Possible processes for cleaning bipolar plates

High-pressure spray cleaning

Low-pressure spray cleaning

Steam cleaning

Hydro cleaning

CO2 rays

Laser cleaning

Atmospheric low-energy plasma

High-energy plasma processes

Thermal oil removal in an inert gas atmosphere


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